(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications

Advanced Interconnect Technologies for Future ULSI Applications

Scaling trends and limitations of existing interconnect technologies are discussed and two prospective future solutions carbon nanotube (CNT) and optical interconnects are examined in detail. The inherent unscalability of metal interconnects and degradation of their performance in the light of ever-increasing transistor density and performance is emphasized. Problems with multi-layer low-k/copp...

Advanced Optical Technologies for Space Exploration (Invited)

NASA Langley Research Center is involved in the development of photonic devices and systems for space exploration missions. Photonic technologies of particular interest are those that can be utilized for in-space communication, remote sensing, guidance navigation and control, lunar descent and landing, and rendezvous and docking. NASA Langley has recently established a class-100 clean-room whic...

Emerging Interconnect Technologies for 3D Networks-on-Chip

Historically, microchip design has some or all of these functional blocks: computational, storage, communication, and I/O. Microchip technologies have evolved from large-scale integrated (LSI) to very-large-scale integrated (VLSI) to ultra-large-scale integrated (ULSI) systems. The current ULSI technology, where the chip itself constitutes the entire functional system, defines a modern system-o...

Advanced Lithography: Nanoimprint Lithography for Semiconductor and Interconnect Technologies

Advanced Fuzzy Logic Technologies in Industrial Applications

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